Toshiba and SanDisk announces new 3D NAND

Toshiba and SanDisk today announced development of the world’s first 48-layers 3D stacked flash memory called BiCS.

The chip is based on 48-layer stacking process, which enhances the reliability of write /erase endurance and boosts write speed. It is suited for use in diverse applications, Smartphones, Future laptops and SSDs.


Mass production will begun after 2016, when construction at fab2 will be completed at Yokkaichi Operations.

Source: Toshiba

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