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Toshiba and SanDisk announces new 3D NAND

Toshiba and SanDisk today announced development of the world’s first 48-layers 3D stacked flash memory called BiCS.

The chip is based on 48-layer stacking process, which enhances the reliability of write /erase endurance and boosts write speed. It is suited for use in diverse applications, Smartphones, Future laptops and SSDs.

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Mass production will begun after 2016, when construction at fab2 will be completed at Yokkaichi Operations.

Source: Toshiba

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